Failure analysis of a thin-film nitride MEMS package

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1557-1561

  Li, Q ^a,b   Goosen, J F L ^b   van Beek, J T M ^c   van Keulen, F ^b   Phan, K L ^c   Zhang, G Q ^b,c  

^a MATERIALS INNOVATION INSTITUTE M2I   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; DEGASSING; FLIP CHIP DEVICES; MEMS; MICROELECTROMECHANICAL DEVICES; NITRIDES; NONMETALS; PACKAGING MATERIALS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR; SEALING (CLOSING); SILICON; SILICON NITRIDE; TESTING; THIN FILM DEVICES;

ACCELERATED TESTING; CHARACTERIZATION TECHNIQUES; ELEVATED TEMPERATURES; FAILURE MECHANISMS; MEMS PACKAGING; PECVD SILICON NITRIDE; SEALING MATERIAL; TEST STRUCTURES;

FAILURE ANALYSIS;

EID: 50249170332     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.036     Document Type: Article

References (13)

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