A low temperature vacuum package utilizing porous alumina thin film encapsulation

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn 2006, Issue , 2006, Pages 126-129

  He, Rihui ^a,b   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b QUALCOMM INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ASPECT RATIO; ELECTRONICS PACKAGING; LOW TEMPERATURE EFFECTS; POROUS MATERIALS; THIN FILMS; VACUUM APPLICATIONS;

ON-WAFER PACKAGING; POROUS ALUMINA MEMBRANES; SACRIFICIAL MATERIAL; THIN FILM ENCAPSULATION;

ENCAPSULATION;

EID: 33750114337     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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