Metal-transfer-micromolded three-dimensional microelectrode arrays for in-vitro brain-slice recordings

Journal of Microelectromechanical Systems

Volumn 20, Issue 2, 2011, Pages 396-409

  Rajaraman, Swaminathan ^a,b   Choi, Seong O ^a,c   McClain, Maxine A ^a,b   Ross, James D ^b,d   Laplaca, Michelle C ^d   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b AXION BIOSYSTEMS   (United States)

^c Georgia Institute of Technology   (United States)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Electrophysiological spike recordings; metal transfer micromolding (MTM); neuronal interfacing; threedimensional microelectrode arrays (3 D MEAs)

Indexed keywords

BRAIN SLICES; CAPPING TECHNIQUE; ELECTRICAL CHARACTERIZATION; ELECTROPHYSIOLOGICAL RECORDINGS; ELECTROPHYSIOLOGICAL SPIKE RECORDINGS; HIGH FREQUENCY HF; IMPEDANCE ESTIMATION; IMPEDANCE SPECTROSCOPY; IN-VITRO; ION ETCHING; MANUFACTURING TECHNOLOGIES; METAL TRANSFER MICROMOLDING; METAL TRANSFER MICROMOLDING (MTM); METALLIZATIONS; MICRO-ELECTRO-MECHANICAL; MICROELECTRODE ARRAY; NEURONAL INTERFACING; PARYLENES; POLYMERIC SUBSTRATE; SELECTIVE DEPOSITION; SELF-ALIGNED; SHADOW MASK; TISSUE SLICE;

BIOCOMPATIBILITY; CHARACTERIZATION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROPHYSIOLOGY; FREQUENCY ESTIMATION; METALLIZING; METALS; MICROELECTRODES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PRINTED CIRCUIT BOARDS; THREE DIMENSIONAL;

MOLDING;

EID: 79953733661     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2105253     Document Type: Article

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