Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2010, Pages 163-170

  Altmann, Frank ^a   Petzold, Matthias ^a   Schmidt, Christian ^a   Salzer, Roland ^a   Cassidy, Cathal ^b   Tesch, Paul ^c   Smith, Noel ^c  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b AMS AG   (Austria)

^c Oregon Physics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAULT ISOLATION; FAULT LOCALIZATION; FLIP CHIP; FOCUSED ION BEAM TECHNIQUE; HIGH RATE; HIGH RESOLUTION; INTEGRATED DEVICE; LOCKIN THERMOGRAPHY; MATERIAL ANALYSIS; METHODICAL APPROACH; NON DESTRUCTIVE; TARGET PREPARATION; THROUGH SILICON VIAS;

FAILURE ANALYSIS; SEMICONDUCTOR DEVICES; THREE DIMENSIONAL;

QUALITY ASSURANCE;

EID: 79952357688     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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