Failure analysis of stacked-die devices by combining non-destructive localization and target preparation methods

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2009, Pages 319-323

  Schmidt, Christian ^a   Simon, Michél ^a   Altmann, Frank ^a   Nowodzinski, Antoine ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE DEFECTS; COMPLEX DEVICES; CROSS-SECTION ANALYSIS; DIE DEVICES; INNER DEFECTS; INTER-CHIP; LOCKIN THERMOGRAPHY; MULTI-CHIP; NON DESTRUCTIVE; ROOT CAUSE; TARGET PREPARATION; X RAY INSPECTION;

DEFECTS; FAILURE ANALYSIS; FLIP CHIP DEVICES; OHMIC CONTACTS; REMOTE SENSING; SAFETY FACTOR;

QUALITY ASSURANCE;

EID: 77649092860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. rd Int'l Symp for Testing and Failure Analysis, San Jose, CA, November 2007
2. Khandekar, S.. et al., "Liquid Crystal Microscopy," EDFAS microelectronic Failure Analysis, Fourth edition (2002), pp. 739-744.
3. rd Int'l Symp for Testing and Failure Analysis, Austin, Texas, November 2006
4. Mathewson,A., et al., "Detailed Characterisation of Ni Microinsert Technology for Flip Chip Die on Wafer attachment" IEEE Conference on Microelectronic Test Structures, pp.117-122,2008
5. Boutry,H., et al., "Reliability charaterization and process optimization of Ni-based Microinsert interconnections for Flip Chip die on wafer attachment" IEEE Electronic Components and Technology Conference (ECTC), San Diego, 2009