Micro structure analysis for System in Package components ? Novel tools for fault isolation, target preparation, and high-resolution material diagnostics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1296-1302

  Petzold, M ^a   Altmann, F ^a   Krause, M ^a   Salzer, R ^a   Schmidt, C ^a   Martens, S ^b   MacK, W ^b   Domer H ^c   Nowodzinski, A ^d  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c CARL ZEISS SMT AG   (Germany)

^d CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL APPROACH; DEFECT LOCALIZATIONS; ELECTRON BACK SCATTER DIFFRACTION; FAULT ISOLATION; FUTURE APPLICATIONS; HIGH RESOLUTION; HIGH-CURRENT; INTEGRATED MICROSYSTEMS; INTERMETALLIC COMPOUNDS; LOCKIN THERMOGRAPHY; MATERIAL ANALYSIS; NON DESTRUCTIVE; PACKAGED MICROSYSTEMS; PULSED LASER ABLATION; SAMPLE QUALITY; SCANNING ELECTRONS; SEM; SYSTEM IN PACKAGE; SYSTEM IN PACKAGE TECHNOLOGIES; TARGET PREPARATION; TEXTURE ANALYSIS;

ABLATION; INTERMETALLICS; MICROSYSTEMS; PULSED LASER APPLICATIONS; PULSED LASERS; QUALITY ASSURANCE; TECHNOLOGY;

FAILURE ANALYSIS;

EID: 77955210503     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490648     Document Type: Conference Paper

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