Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Volumn , Issue , 2010, Pages

  Martens, Stefan ^a   Fink, Markus ^a   Mack, Walter ^a   Voelklein, Friedemann ^b   Wilde, Juergen ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b RHEINMAIN UNIVERSITY OF APPLIED SCIENCES   (Germany)

^c UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ABSORBED ENERGY; ABSORPTION MECHANISMS; CRUCIAL PARAMETERS; DIODE-PUMPED SOLID-STATE LASER; ELECTRON EXCITATIONS; INTEGRATED DEVICE; INTEGRATED SYSTEMS; INVERSE ANALYSIS; IRRADIATED AREA; LASER-CUT; MAXIMUM TEMPERATURE; METAL INTERCONNECTS; MOLDING COMPOUND; MOLTEN SILICON; PENETRATION DEPTH; PULSE DURATIONS; PULSED LASER ABLATION; RAPID-HEATING; REAL DEFECTS; SILICON DIE; SIMULATION METHODS; SIMULATION RESULT; SIMULATION-BASED ANALYSIS; SINGLE LASERS; SYSTEM-IN-PACKAGE; TARGET PREPARATION; THERMAL SIMULATIONS; THERMAL WAVE; TOTAL ENERGY; TRANSIENT TEMPERATURE; VAPORISATION;

CELLULAR RADIO SYSTEMS; CORROSION; CRACKS; DIES; EXPERIMENTS; FAILURE ANALYSIS; HEAT AFFECTED ZONE; HEATING; HEATING RATE; INTEGRATED OPTICS; INTERNET PROTOCOLS; LASER ABLATION; LASER EXCITATION; METAL MOLDING; MICROELECTRONICS; MICROSYSTEMS; PACKAGING MATERIALS; PASSIVATION; PULSED LASERS; PUMPING (LASER); QUALITY ASSURANCE; SILICON COMPOUNDS; SMELTING; SYSTEMS ANALYSIS; TARGETS; THERMOANALYSIS; THREE DIMENSIONAL;

PULSED LASER APPLICATIONS;

EID: 77953697956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2010.5464586     Document Type: Conference Paper

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