Reliability model for step-stress and variable-stress situations

IEEE Transactions on Reliability

Volumn 60, Issue 1, 2011, Pages 219-233

  Benavides, Efrén M ^a  

^a UNIVERSIDAD POLITÉCNICA DE MADRID   (Spain)

Author keywords

Accelerated test; Coffin Manson exponent; step stress; temperature cycling; thermal shock; thin film cracking; variable stress; Weibull

Indexed keywords

ACCELERATED TESTS; COFFIN-MANSON EXPONENT; STEP-STRESS; TEMPERATURE CYCLING; THIN FILM CRACKING; VARIABLE STRESS; WEIBULL;

ANALOG DIFFERENTIAL ANALYZERS; DIFFERENTIAL EQUATIONS; ELECTRIC PROPERTIES; RELIABILITY; SHOCK TESTING; THERMAL SHOCK; THIN FILM CIRCUITS; THIN FILMS;

WEIBULL DISTRIBUTION;

EID: 79952183558     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/TR.2010.2085574     Document Type: Article

References (46)

1. H. Poor, An Introduction to Signal Detection and Estimation. New York: Springer-Verlag, 1985, ch. 4.
2. Y.-L. Wu, S.-T. Lin, and C.-P. Lee, "Time-to-breakdown Weibull distribution of thin gate oxide subjected to nanoscaled constant-voltage and constant-current stresses," IEEE Trans. Dev. Mat. Rel., vol. 8, no. 2, pp. 352-357, Jun. 2008.
3. R. M. Hill and L. A. Dissado, "Theoretical basis for the statistics of dielectric breakdown," J. Phys. C, Solid State Phys., vol. 16, no. 11, pp. 2145-2156, Apr. 1983.
4. K. Yamabe and K. Taniguchi, "Time-dependent dielectric breakdown of thin thermally grown SiO2 films," IEEE Trans. Electron Devices, vol. ED-32, no. 2, pp. 423-428, Feb. 1985.
5. H. K. T. Ng, "Parameter estimation for a modifiedWeibull distribution, for progressively type-II censored (Pubitemid 41638253)
6. C. D. Lai, M. Xie, and D. N. P. Murthy, "A modified Weibull distribution," IEEE Trans. Reliab., vol. 52, no. 1, pp. 33-37, Mar. 2003.
7. S. Nadarajah and S. Kotz, "On some recent modifications of Weibull distribution," IEEE Trans. Reliab., vol. 54, no. 4, pp. 561-562, Dec. 2005. (Pubitemid 43000688)
8. H. Hirose, "Maximum likelihood parameter estimation in the extended Weibull distribution and its applications to breakdown voltage estimation," IEEE Trans. Dielectr. Electr. Insul., vol. 9, no. 4, pp. 524-536, Aug. 2002.
9. R. Jiang and D. N. P. Murthy, "The exponentiated Weibull family: A graphical approach," IEEE Trans. Reliab., vol. 48, no. 1, pp. 68-72, Mar. 1999.
10. J. Liu, L. Cao, M. Xie, T.-N. Goh, and Y. Tang, "A general Weibull model for reliability analysis under different failure criteria-application on anisotropic conductive adhesive joining technology," IEEE Trans. Electron. Packag. Manuf., vol. 28, no. 4, pp. 322-327, Oct. 2005. (Pubitemid 41638185)
11. S. Levada, M. Meneghini, G. Meneghesso, and E. Zanoni, "Analysis of DC current accelerated life tests of GaN LEDs using a Weibullbased statistical model," IEEE Trans. Dev. Mat. Rel., vol. 5, no. 4, pp. 688-693, Dec. 2005. (Pubitemid 43119865)
12. W. B. Nelson, "Accelerated life testing step-stress models and data analysis," IEEE Trans. Reliab., vol. R-29, pp. 103-108, Jun. 1980.
13. W. B. Nelson, Accelerated Testing, Statistical Models, Test Plans and Data Analysis. New York: John Wiley & Sons, 1990.
14. E. Gouno and N. Baklakrishnan, Handbook of Statistics, N. Balakrishnan and C. R. Rao, Eds. : , 2001, ch. 23, pp. 623-639.
15. N. Balakrishnan, "A synthesis of exact inferential results for exponential step-stress models and associated optimal accelerated life-tests," Metrika, vol. 69, pp. 351-396, 2009.
16. N. Balakrishnan, D.Kundu, H. K. T. Ng, and N. Kannan, "Point and interval estimation for a simple step-stress model with type-II censoring," Journal of Quality Technology, vol. 39, pp. 35-47, 2007. (Pubitemid 46381895)
17. L.-C. Tang, "Multiple-steps Step-stress Accelerated Life Test," in Handbook of Reliability Engineering, H. Pham, Ed. New York: , 2003, pp. 441-455.
18. R. Miller and W. B. Nelson, "Optimum simple step-stress plans for accelerated life testing," IEEE Trans. Reliability, vol. R-32, pp. 59-65, Apr. 1983. (Pubitemid 13554901)
19. D. S. Bai, M. S. Kim, and S. H. Lee, "Optimum simple step-stress accelerated life tests with censoring," IEEE Trans. Reliability, vol. 38, pp. 528-532, Dec. 1989. (Pubitemid 20665812)
20. H. Ma and W. Q. Meeker, "Optimum step-stress accelerated life test plans for log-location-scale distributions," Naval Research Logistics, vol. 55, pp. 551-562, 2008.
21. N. Fard and C. Li, "Optimal simple step stress accelerated life test design for reliability predicción," Journal of Statistical Planning and Inference, vol. 139, pp. 1799-1808, 2009.
22. I. H. Khamis, "Optimum M-step, step-stress test with k stress variables," Communication in Statistics, Computation and Simulation, vol. 26, no. 4, 1997.
23. N. Balakrishnan, Q. Xie, and D. Kundu, "Exact inference for a simple step-stress model from the exponential distribution under time constraint," Ann. Inst. Stat. Math., vol. 61, pp. 251-274, 2009.
24. C. Xiong and M. Ji, "Analysis of grouped and censored data from stepstress life test," IEEE Trans. Reliability, vol. 53, no. 1, pp. 22-28, Mar. 2004.
25. E. Gouno, A. Sen, and N. Balakrishnan, "Optimal step-stress test under progressive type-I censoring," IEEE Trans. Reliability, vol. 53, no. 3, pp. 388-393, Sep. 2004.
26. D. Han, N. Balakrishnan, A. Sen, and E. Gouno, "Corrections on "Optimal Step-Stress Test under Progressive Type-I Censoring," IEEE Trans. Reliability, vol. 55, no. 4, pp. 613-614, Dec. 2006.
27. N. Balakrishnan and D. Han, "Optimal step-stress testing for progressively type-I censored data from exponential distribution," Journal of Statistical Planning and Inference, vol. 139, pp. 1782-1798, 2009.
28. I. H. Khamis and J. J. Higgins, "A new model for step-stress testing," IEEE Trans. Reliab., vol. 47, no. 2, pp. 131-134, Jun. 1998. (Pubitemid 128744680)
29. G. K. Bhattacharyya and Z. Soejoeti, "A tampered failure rate model for step-stress accelerated life test," Commn, Statist.-Theory Meth., vol. 18, no. 5, pp. 1627-1643, 1989.
30. M. Kateri and N. Balakrishnan, "Inference for a simple step-stress model with type-II censoring, andWeibull distributed lifetimes," IEEE Trans. Reliability, vol. 57, no. 4, pp. 616-626, 2008.
31. N. Balakrishnan, L. Zhang, and Q. Xie, "Inference for a simple stepstress model with type-I censoring lognormally distributed lifetimes," Communications in Statistics-Theory and Methods, vol. 38, no. 10, pp. 1709-1960, 2009.
32. W. Weibull, "A statistical distribution of wide applicability," ASME Journal of Applied Mechanics, pp. 293-297, Sep. 1951.
33. W. Weibull, "A statistical theory of the strength of materials," I.V.A. Proceedings, no. 151, 1939.
34. D. J. DiMaria and J. H. Stathis, "Ultimate limit for defect generation in ultra-thin silicon dioxide," Appl. Phys. Lett., vol. 77, no. 22, pp. 3230-3232, 1997. (Pubitemid 127662600)
35. M. Fukuda, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston, MA: Artech House, 1995.
36. E. Y.Wu, J. Suñé, and W. Lai, "On theWeibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination- Part II: Experimental results and the effects of stress conditions," IEEE Trans. Electron Devices, vol. 49, no. 12, pp. 2141-2150, Dec. 2002.
37. T. A. Harris, Rolling Bearing Analysis, 4th ed. New York: John Wiley & Sons, Inc., 2001, 1086.
38. R. C. Blish, "Temperature cycling and thermal shock failure rate modeling," in IEEE International Reliability Physics Symposium Proceedings, 1997, pp. 110-117.
39. P. A. Tobias and D. C. Trindade, Applied Reliability. New York: Van Nostrand Reinhold Company Inc., 1986.
40. C. F. Joyce, "A Weibull model to characterize lifetimes of aluminum alloy electrical wire connections," IEEE Trans. Compon. Hybrids Manuf. Technol., vol. 14, no. 1, pp. 124-133, Mar. 1991.
41. Temperature Cycling, JESD22-A104D, JEDEC Solid State Technology Association Mar. 2009.
42. Thermal Shock, JESD22-A106B, JEDEC Solid State Technology Association Jun. 2004.
43. Mil-STD-883G, Methods 1010.8 (Temperature Cycling) and 1011.9 (Thermal Shock).
44. R. C. Blish and P. R. Vaney, "Failure rate model for thin film cracking in plastic ICs," in IEEE International Reliability Physics Symposium Proceedings, 1991, pp. 22-29. (Pubitemid 21717614)
45. R. C. Blish, J. C. Black, B. Hui, and D. T. Prince, "Technique for determining a prudent voltage stress to improve product quality and reliability," Microelectronics Reliability, vol. 40, pp. 1615-1618, 2000. (Pubitemid 129662297)
46. J. E. Marsden, Elementary Classical Analysis. New York: W.H. Freeman and Company, 1974.