A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 4, 2005, Pages 322-327

  Liu, Johan ^a,b,c   Cao, Liqiang ^a,b   Xie, Min ^d   Goh, Thong Ngee ^d   Tang, Yong ^d  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SWEREA IVF   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

^d NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Anisotropic conductive adhesive; Failure criteria; Flip chip; Reliability; Weibull model

Indexed keywords

ADHESIVES; ANISOTROPY; FAILURE (MECHANICAL); FLIP CHIP DEVICES; MATHEMATICAL MODELS; PROBES; RELIABILITY; THERMAL CYCLING; THERMAL EFFECTS; WEIBULL DISTRIBUTION;

ANISOTROPIC CONDUCTIVE ADHESIVE; FAILURE CRITERIA; FLIP CHIP PACKAGING; WEIBULL MODEL;

CHIP SCALE PACKAGES;

EID: 27844479671     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.856539     Document Type: Article

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