Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design

International Journal of Heat and Mass Transfer

Volumn 53, Issue 5-6, 2010, Pages 1004-1014

  Walchli R ^a,b   Brunschwiler, T ^a   Michel, B ^a   Poulikakos, D ^b  

^a IBM RESEARCH ZURICH   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

Heat transfer in electronics; Liquid cooling; Microchannel

Indexed keywords

CFD MODELING; CFD SIMULATIONS; CHANNEL NETWORK; CHIP SCALE; COLD PLATES; COMPLEX DEVICES; COOLING POTENTIAL; DESIGN TOOL; ELECTRONICS COOLING; EXPERIMENTAL DATA; HIGH PERFORMANCE COMPUTING SYSTEMS; INCREASE IN PRESSURE; ITERATION PROCEDURE; LENGTH SCALE; LIQUID COOLING; MESH DESIGNS; MICROCHANNEL COOLERS; MICROCHANNEL NETWORK; MICROCHANNEL SYSTEMS; MODEL PREDICTION; NETWORK MODELING; PERIODIC BOUNDARY CONDITIONS; PUMPING POWER; THERMAL CHARACTERISTICS; THERMAL CONDITION; THERMAL RESISTANCE; UNIT CELLS;

COMPUTATIONAL FLUID DYNAMICS; CONTACTS (FLUID MECHANICS); COOLING; COOLING SYSTEMS; ELECTRONIC EQUIPMENT; HEAT EXCHANGERS; HEAT RESISTANCE; LIQUIDS; PRESSURE DROP; SIMULATORS;

MICROCHANNELS;

EID: 72649087361     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2009.11.012     Document Type: Article

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