Single-phase liquid cooled microchannel heat sink for electronic packages

Applied Thermal Engineering

Volumn 25, Issue 10, 2005, Pages 1472-1487

  Zhang, H Y ^a   Pinjala, D ^a   Wong, T N ^b   Toh, K C ^b   Joshi, Y K ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Analytical model; Experiments; Flip chip ball grid array (FCBGA); Liquid cooling; Microchannel heat sink; Respective thermal resistance

Indexed keywords

CHARACTERIZATION; COOLING; FLIP CHIP DEVICES; HEAT RESISTANCE; NUSSELT NUMBER; PRESSURE DROP; REYNOLDS NUMBER; SENSORS;

ANALYTICAL MODEL; FLIP CHIP BALL GRID ARRAY (FCBGA); LIQUID COOLING; MICROCHANNEL HEAT SINK; RESPECTIVE THERMAL RESISTANCE;

ELECTRONICS PACKAGING;

EID: 14544308245     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2004.09.014     Document Type: Article

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