Nanoscale silver paste and its sintering for attaching semiconductor devices

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2007, Issue , 2007, Pages 35-

  Calata, J N ^a   Bai, G ^a   Lei, G ^a   Lu, G Q ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SILVER; DEVICE INTERCONNECTION; NANOSCALE SILVER PASTES; ORGANIC BINDER SYSTEMS;

ELECTRIC POWER SYSTEM INTERCONNECTION; MECHANICAL PROPERTIES; SEMICONDUCTOR DEVICES; SILVER; SINTERING; THERMAL CONDUCTIVITY;

NANOSTRUCTURED MATERIALS;

EID: 34249682671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)