Low cost copper-based electrically conductive adhesives

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 715-720

  Zhang, Rongwei ^a,b   Wong, C P ^a,b,c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BULK RESISTIVITY; CONDUCTIVE ADHESIVE; COPPER-BASED; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH COSTS; ISOTROPICALLY CONDUCTIVE ADHESIVES; LOW COSTS; SILANE COUPLING AGENT;

ADHESIVES; COPPER; COSTS; COUPLING AGENTS; CURING; ELECTRONICS PACKAGING; FILLERS; INDEPENDENT COMPONENT ANALYSIS; ORGANIC COMPOUNDS;

SILVER;

EID: 79951891267     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702731     Document Type: Conference Paper

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