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Volumn 4, Issue 1, 2011, Pages
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Crack-free, highly conducting GaN layers on Si substrates by Ge doping
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK FREE;
CRACK-FREE LAYERS;
DEVICE DESIGN;
DISLOCATION CLIMB;
DOPED LAYERS;
EDGE DISLOCATION;
ENGINEERING METHODS;
GAN LAYERS;
GE-DOPING;
GERMANIUM DOPING;
INDUCED DISLOCATION;
SI SUBSTRATES;
SILICON DOPING;
STRAIN EVOLUTION;
SURFACE-ROUGHENING;
CRACKS;
DOPING (ADDITIVES);
EDGE DISLOCATIONS;
GALLIUM NITRIDE;
GERMANIUM;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON;
TENSILE STRESS;
GALLIUM ALLOYS;
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EID: 79251536520
PISSN: 18820778
EISSN: 18820786
Source Type: Journal
DOI: 10.1143/APEX.4.011001 Document Type: Article |
Times cited : (73)
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References (18)
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