Comprehensive moisture diffusion characteristics of epoxy molding compounds over solder reflow process temperature

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 4, 2010, Pages 809-818

  Jang, Changsoo ^a   Han, Bongtae ^a   Yoon, Samson ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Diffusion property; moisture diffusion; reflow process

Indexed keywords

DIFFUSION PROPERTIES; DIFFUSIVITIES; EPOXY MOLDING COMPOUNDS; EXPERIMENTAL PROCEDURE; FICKIAN DIFFUSIVITY; MOISTURE DIFFUSION; MOISTURE DISTRIBUTION; NON-FICKIAN; NON-FICKIAN DIFFUSION; NUMERICAL SIMULATION; REFLOW PROCESS; SOLDER REFLOW;

ABSORPTION; COMPUTER SIMULATION; DESORPTION; MOISTURE; MOLDING; SHEET MOLDING COMPOUNDS; SOLDERING;

DIFFUSION;

EID: 78651076118     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2010.2063430     Document Type: Article

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