An effective method of characterizing moisture desorption of polymeric materials at high temperature

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 70-75

  Shi, Y ^a   Tay, A A O ^a   Wong, E H ^b   Ranjan, R ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; DESORPTION; ELECTRONICS PACKAGING; GAS CHROMATOGRAPHY; GRAVIMETRIC ANALYSIS; MOISTURE; POLYMERS; SOLDERING; STRENGTH OF MATERIALS; THERMOGRAVIMETRIC ANALYSIS; TITRATION;

DIE-ATTACH MATERIALS; GAS CHROMATOGRAPHY/MASS SPECTROMETRY; GRAVIMETRIC METHODS; KARL FISCHER TITRATION; LOWER TEMPERATURES; MOISTURE ADSORPTION; MOISTURE DESORPTION; MOISTURE DIFFUSION;

PACKAGING MATERIALS;

EID: 78651112233     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185600     Document Type: Conference Paper

References (13)

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