Electrically yielding collective hybrid bonding for 3D stacking of ICs

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 11-13

  Jourdain, Anne ^a   Soussan, Philippe ^a   Swinnen, Bart ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING; BOND GUARANTEE; BONDING PROPERTY; DIELECTRIC ADHESIVES; DIRECT BONDING; ELECTRICAL MEASUREMENT; GLUE LAYERS; HYBRID BONDING; METALLIC INTERCONNECTS; PICK-AND-PLACE; RELIABLE OPERATION; STACKED DIE; THIN WAFERS; THROUGHPUT OPTIMIZATION;

DIES; MECHANICAL STABILITY; POLYMERS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70349668537     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5073989     Document Type: Conference Paper

References (2)

1. A. Jourdain, S. Stoukatch, P. De Moor, W. Ruythooren, S. Pargfrieder, B. Swinnen and E. Beyne, , "Simultaneous Cu-Cu and Compliant Dielectric Bonding for 3D Stacking of ICs", Proc. IITC Conference, June 4-6, 2007, Burlingame, CA, pp. 207-209.
2. B. Swinnen, A. Jourdain, P. De Moor, E. Beyne C. in "Wafer Level 3-D ICs Process Technology"; edited by S. Tan, R.J. Gutmann, and L.R. Reif (Eds), Springer, ISBN 978-0-387-76532-7, 2008.