Characterization of direct patterned Ag circuits for RF application

Microelectronic Engineering

Volumn 87, Issue 3, 2010, Pages 379-382

  Kim, Jong Woong ^a   Lee, Young Chul ^a   Kim, Jong Min ^a   Nah, Wansoo ^a   Lee, Hyo Soo ^b   Kwon, Hyuk Chon ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

Author keywords

Conductive nano paste; Radio frequency; Screen printing; Sintering temperature

Indexed keywords

AFTER-HEAT TREATMENT; AG NANOPARTICLE; CONDUCTIVE NANO-PASTE; DC RESISTANCE; ELECTRICAL CHARACTERISTIC; ELECTRICAL LOSS; FOUR-POINT PROBE METHOD; FREQUENCY RANGES; HIGH FREQUENCY; HIGH TEMPERATURE; NETWORK ANALYZER; PROBE SYSTEMS; RADIO FREQUENCIES; RF APPLICATIONS; S-PARAMETERS; SCREEN-PRINTED; SI SUBSTRATES; SINTERING TEMPERATURES;

ELECTRIC NETWORK ANALYSIS; LOSS PREVENTION; PRINTING PRESSES; PROBES; RADIO; RADIO WAVES; SCATTERING PARAMETERS; SCREEN PRINTING; SILICON COMPOUNDS; SILVER;

SINTERING;

EID: 74449090884     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.06.012     Document Type: Article

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