Electrochemical migration tests of solder alloys in pure water

Corrosion Science

Volumn 39, Issue 8, 1997, Pages 1415-1430

  Takemoto, T ^a   Latanision, R M ^b   Eagar, T W ^b   Matsunawa, A ^a  

^a OSAKA UNIVERSITY   (Japan)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL GROWTH; DISSOLUTION; ELECTRIC FIELD EFFECTS; ELECTRIC VARIABLES MEASUREMENT; ELECTROCHEMISTRY; INDIUM; LEAD; MATERIALS TESTING; TIN; WATER;

ELECTROCHEMICAL MIGRATION TESTS; ELECTROCHEMICAL SUSCEPTIBILITY; PURE WATER; TIN BASE SOLDER ALLOYS;

SOLDERING ALLOYS;

EID: 0031212224     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0010-938X(97)00038-3     Document Type: Article

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