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Microelectronics Reliability
Volumn 48, Issue 4, 2008, Pages 652-656
Effect of surface finish material on printed circuit board for electrochemical migration
Author keywords

[No Author keywords available]
Indexed keywords

BIAS VOLTAGE; ELECTROCHEMICAL CORROSION; ELECTROCHEMISTRY; ELECTRODES; ELECTROLESS PLATING; POLARIZATION;
EID: 42649135227     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.09.006     Document Type: Article
Times cited : (67)
References (9)
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    • Electrochemical migration tests of solder alloys in pure water
    • Takemoto T., Latanision R.M., Eagar T.W., and Matsunawa A. Electrochemical migration tests of solder alloys in pure water. Corros Sci 39 (1997) 1415-1430
    • (1997) Corros Sci , vol.39 , pp. 1415-1430
    • Takemoto, T.1    Latanision, R.M.2    Eagar, T.W.3    Matsunawa, A.4
  • 2
    • 33644878842 scopus 로고    scopus 로고
    • Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board
    • Lee S.B., Yoo J.Y., Jung J.Y., Park Y.B., Kim Y.S., and Joo Y.C. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board. Thin Solid Films 504 (2006) 294-297
    • (2006) Thin Solid Films , vol.504 , pp. 294-297
    • Lee, S.B.1    Yoo, J.Y.2    Jung, J.Y.3    Park, Y.B.4    Kim, Y.S.5    Joo, Y.C.6
  • 3
    • 0030130218 scopus 로고    scopus 로고
    • New types of reliability problems in porous ceramic based microdevices
    • Harsanyi G. New types of reliability problems in porous ceramic based microdevices. Mater Chem Phys 44 (1996) 85-89
    • (1996) Mater Chem Phys , vol.44 , pp. 85-89
    • Harsanyi, G.1
  • 4
    • 0344631711 scopus 로고    scopus 로고
    • NEOCHIM: an electrochemical method for environmental application
    • Leinz R.W., Hoover D.B., and Meier A.L. NEOCHIM: an electrochemical method for environmental application. J Geochem Explor 64 (1998) 421-434
    • (1998) J Geochem Explor , vol.64 , pp. 421-434
    • Leinz, R.W.1    Hoover, D.B.2    Meier, A.L.3
  • 6
    • 8744310708 scopus 로고    scopus 로고
    • Processing induced material interactions determining the reliability of LTCC multichip modules
    • Harasanyi G. Processing induced material interactions determining the reliability of LTCC multichip modules. Microelectron Reliab 40 (2000) 339-345
    • (2000) Microelectron Reliab , vol.40 , pp. 339-345
    • Harasanyi, G.1
  • 7
    • 0343893607 scopus 로고    scopus 로고
    • Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?
    • Harsanyi G. Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?. Microelectron Reliab 39 (1999) 1407-1411
    • (1999) Microelectron Reliab , vol.39 , pp. 1407-1411
    • Harsanyi, G.1
  • 8
    • 0343408455 scopus 로고    scopus 로고
    • Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection system
    • Harsanyi G. Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection system. Microelectron Reliab 41 (2001) 229-237
    • (2001) Microelectron Reliab , vol.41 , pp. 229-237
    • Harsanyi, G.1
  • 9
    • 0029325579 scopus 로고
    • Corrosion of metallic materials
    • Martin T., and Pierre R. Corrosion of metallic materials. IEEE Trans Reliab 44 (1995) 271-284
    • (1995) IEEE Trans Reliab , vol.44 , pp. 271-284
    • Martin, T.1    Pierre, R.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.