Inkjet printed System-in-Package design and manufacturing

Microelectronics Journal

Volumn 39, Issue 12, 2008, Pages 1740-1750

  Miettinen, Jani ^a   Pekkanen, Ville ^a   Kaija, Kimmo ^a   Mansikkamäki, Pauliina ^a   Mäntysalo, Juha ^a   Mäntysalo, Matti ^a   Niittynen, Juha ^a   Pekkanen, Jussi ^a   Saviauk, Taavi ^a   Rönkkä, Risto ^b  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Inkjet; Printable electronics; System in package

Indexed keywords

CELLULAR RADIO SYSTEMS; DESIGN; INDUSTRIAL ENGINEERING; PROCESS ENGINEERING; PRODUCTION ENGINEERING; SYSTEMS ANALYSIS;

ADDITIVE MANUFACTURING; DESIGN CHANGES; DIRECT WRITINGS; ELECTRONICS MANUFACTURING; ETCHING PROCESSES; FAST PROTOTYPING; FUNCTIONAL SYSTEMS; INKJET; MANUFACTURING PROCESSES; MASKING TECHNOLOGIES; MATERIAL LOSSES; PACKAGE DESIGNS; PERSONALIZATION; PRINTABLE ELECTRONICS; SYSTEM-IN-PACKAGE;

MANUFACTURE;

EID: 56049094155     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2008.02.014     Document Type: Article

References (20)

1. Street R.A., and Wong W.S. Jet printing flexible displays. Mater. Today 9 4 (2006)
2. R. Rönkkä, S. Pienimaa, P. Mansikkamäki, M. Mäntysalo, Flexibility in inkjet and nano-material based electronics manufacturing business, in: Proceeding of 16th European Microelectronics and Packaging Conference, Oulu, Finland, 17-20 June, 2007.
3. Mei J., Lovell M.R., and Mickle M.H. Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits. IEEE Trans.Electron. Packag. Manufa. 28 3 (2005)
4. J.C. Liou, C.H. Liu, C.J. Chen, A bubble-jet MEMS printhead integrated with CMOS de-multiplexer, in: Proceedings of IEEE Advanced Semiconductor Manufacturing Conference and Workshop 2004, 4-6 May, 2004.
5. K. Youngjae, S. Wonchul, P. Changsung, Y. Youngseuck, J. Jaewoo, O. Yongsoo, The effects of driving waveform of piezoelectric industrial inkjet head for fine patterns, in: Proceedings of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, January, 18-21, 2006, Zhuhai, China.
6. Y. Ishida, K. Matsuzaki, M. Baba, T. Asano, Electrostatic inkjet head fabricated by anodization of Si, in: Proceedings of International Microprocesses and Nanotechnology Conference. October, 29-31. 2003.
7. Chason M., Brazis P.W., Zhang J., Kalyanasundaram K., and Gamota D.R. Printed organic semiconducting devices. Proce. IEEE 93 7 (2005)
8. Shimoda T., Matsuki Y., Furusawa M., Aoki T., Yudasaka I., Tanaka H., et al. Solution-processed silicon films and transistors. Nature (2006) 440
9. ®, in: Proceedings of 39th IMAPS International Symposium on Electronics, November 11-15, 2006, San Diego, CA, USA.
10. M. Mäntysalo, P. Mansikkamäki, J. Miettinen, K. Kaija, S. Pienimaa, R. Rönkkä, et al., Evaluation of inkjet technology for electronic packaging and system integration, in: Proceedings of 57th Electronic components and technology Conference, Reno, NV, USA, May 29-June 1, 2007.
11. V. Pekkanen, M. Mäntysalo, J. Miettinen, P. Mansikkamäki, Novel packaging technology for combo memory package, in: Proceedings of 16th European Microelectronics and Packaging Conference, Oulu, Finland, 17-20 June, 2007.
12. L. Zhu, Y. Sun, J. Xu, Z. Zhang, D.W. Hess, C.P. Wong, Aligned carbon nanotubes for electrical interconnect and thermal management, in: Proceedings of 55th Electronic Components and Technology Conference, Lake Buena Vista, USA, 2005.
13. Buffat Ph., and Borel J.P. Size effect on the melting temperature of gold particles. Phys. Rev.A 13 6 (1976)
14. Pienimaa S., Miettinen J., and Ristolainen E. Stacked modular package. IEEE Trans.Adv. Packag. 27 3 (2004)
15. Redinger D., Molesa S., Yin S., Farschi R., and Subramanian V. An ink-jet-deposited passive component process for RFID. IEEE Trans. Electron Devices 51 12 (2004)
16. Sanaur S., Whalley A., Alameddine B., Carnes M., and Nuckolls C. Jet-printed electrodes and semiconducting oligomers for elaboration of organic thin-film transistors. Organic Electron. 7 5 (2006)
17. de Gennes P.G. Wetting: statics and dynamics. Rev.Mod. Phys. Part 1 57 3 (1985)
18. K. Kaija, J. Miettinen, M. Mäntysalo, P. Mansikkamäki, M. Kuchiki, M. Tsubouchi, R. Rönkkä, Modeling the Effect of assembly parameters on warpage and stresses of molded package for inkjet printing, in: Proceedings of 16th European Microelectronics and Packaging Conference, Oulu, Finland, June 17-20, 2007.
19. J. Pekkanen, M. Heino, P. Mansikkamäki, M. Mäntysalo, R. Rönkkä, Laser sintering of Ag nano paste for printed electronics, in: Nanotech Northern Europe 2007, Helsinki, Finland.
20. K. Kaija, V. Pekkanen, et al. Controlling warpage of molded package for inkjet manufacturing, Microelectron. Eng. (2008).