Electrochemical method for slicing Si blocks into wafers using platinum wire electrodes

Solar Energy Materials and Solar Cells

Volumn 95, Issue 2, 2011, Pages 716-720

  Lee, Chia Lung ^a   Kanda, Yuji ^a   Ikeda, Shigeru ^a   Matsumura, Michio ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Electrochemical method; Metallic catalysts; Silicon; Slicing

Indexed keywords

AG/AGCL; ANODIC POTENTIALS; AQUEOUS SOLUTIONS; CATALYTIC ELECTRODES; COUNTER ELECTRODES; DEPTH OF GROOVE; ELECTROCHEMICAL METHODS; HF CONCENTRATION; HF SOLUTIONS; METALLIC CATALYSTS; PLATINUM WIRE ELECTRODES; POLYCRYSTALLINE; POROUS SILICON LAYERS; SI WAFER; SINGLE-CRYSTALLINE; SLICING;

CATALYSTS; CRYSTALLINE MATERIALS; ELECTROCHEMICAL ELECTRODES; HYDROFLUORIC ACID; PLATINUM; POROUS SILICON; SILICON WAFERS; WIRE;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 78650691985     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2010.10.009     Document Type: Article

References (18)

1. H.J. Mller Basic mechanisms and models of multi-wire sawing Adv. Eng. Mater. 6 2004 501 513
2. H.J. Mller, C. Funke, M. Rinio, and S. Scholz Multicrystalline silicon for solar cells Thin Solid Films 487 2005 179 187
3. H.J. Mller Wafering of silicon crystals Phys. Status Solidi A 203 2006 659 669
4. W.F. Struth, K. Steffens, and W. Knig Wafer slicing by internal diameter sawing Precis. Eng. 10 1988 29 34
5. X. Wei, R.W. Huang, S.H. Lai, and Z.H. Xie Vibration analysis of ID slicing process and wafer measurement Key Eng. Mater. 315316 2006 641 645
6. S. Chonan, Z.W. Jiang, and Y. Yuki Stress analysis of a silicon-wafer slicer cutting the crystal ingot J. Mech. Des. 115 1993 711 717
7. L. Zhu, and I. Kao Galerkin-based modal analysis on the vibration of wire-slurry system in wafer slicing using a wiresaw J. Sound Vib. 283 2005 589 620
8. S. Bhagavat, and I. Kao A finite element analysis of temperature variation in silicon wafers during wiresaw slicing Int. J. Mach. Tools Manuf. 48 2008 95 106
9. W.Y. Peng, and Y.S. Liao Study of electrical discharge machining technology for slicing silicon ingots J. Mater. Process. Technol. 140 2003 274 279
10. H. Takino, T. Ichinohe, K. Tanimoto, S. Yamaguchi, K. Nomura, and M. Kunieda High-quality cutting of polished single-crystal silicon by wire electrical discharge machining Precis. Eng. 29 2005 423 530
11. T. Ideno, H. Inui, S. Takashima, H. Kano, M. Kondo, M. Hiramatsu, and M. Hori Novel silicon wafer slicing technology using atmospheric pressure reactive microplasma Jpn. J. Appl. Phys. 47 2008 5648 5651
12. 2 at different concentrations using silver nanoparticles as catalysts Electrochim. Acta 53 2007 28 34
13. K. Tsujino, and M. Matsumura Boring deep cylindrical nanoholes in silicon using silver nanoparticles as a catalyst Adv. Mater. 17 2005 1045 1047 (Pubitemid 40584346)
14. K. Tsujino, and M. Matsumura Helical nanoholes bored in silicon by wet chemical etching using platinum nanoparticles as catalyst Electrochem. Solid State Lett. 8 2005 C193 C195
15. C.-L. Lee, K. Tsujino, Y. Kanda, S. Ikeda, and M. Matsumura Pore formation in silicon by wet etching using micrometer-sized metal particles as catalysts J. Mater. Chem. 18 2008 1015 1020
16. C.-L. Lee, Y. Kanda, T. Hirai, S. Ikeda, and M. Matsumura Electrochemical grooving of Si wafers using catalytic wire electrodes in HF solution J. Electrochem. Soc. 156 2009 H134 H137
17. Mohamed Shaker Salem, Chia-Lung Lee, Shigeru Ikeda, and Michio Matsumura Acceleration of groove formation in silicon using catalytic wire electrodes for development of a slicing technique J. Mater. Process. Techol. 210 2010 330 334
18. S. Chattopadhyay, and P.W. Bohn Direct-write patterning of microstructured porous silicon arrays by focused-ion-beam Pt deposition and metal-assisted electroless etching J. Appl. Phys. 96 2004 6888 6894