Novel silicon wafer slicing technology using atmospheric-pressure reactive microplasma

Japanese Journal of Applied Physics

Volumn 47, Issue 7 PART 1, 2008, Pages 5648-5651

  Ideno, Takuya ^a   Inui, Hirotoshi ^b   Takashima, Seigo ^a   Kano, Hiroyuki ^c   Kondo, Michio ^d   Hiramatsu, Mineo ^b   Hori, Masaru ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b MEIJO UNIVERSITY   (Japan)

^c NU Eco Engineering Co Ltd   (Japan)

^d NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Atmospheric pressure plasma; Etching; Microplasma; Si slicing

Indexed keywords

ATMOSPHERICS; ELECTRIC GENERATORS; ETCHING; NONMETALS; PHOTOVOLTAIC CELLS; PLASMA DEVICES; PLASMA DIAGNOSTICS; PLASMA DISPLAY DEVICES; POLYSILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SOLAR CELLS; SOLAR ENERGY; SOLAR EQUIPMENT; SUBSTRATES;

A STABLES; ATMOSPHERIC-PRESSURE PLASMA; ELECTRICITY GENERATIONS; LONG LIFETIMES; MICROPLASMA; POLYCRYSTALLINE SILICONS; SI SLICING; SILICON SUBSTRATES; SILICON WAFER SLICING; SINGLE CRYSTALLINE SILICONS; TECHNOLOGY USING; THIN SILICON WAFERS;

SILICON WAFERS;

EID: 55149123152     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.5648     Document Type: Article

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