Study of electrical discharge machining technology for slicing silicon ingots

Journal of Materials Processing Technology

Volumn 140, Issue 1-3 SPEC., 2003, Pages 274-279

  Peng, W Y ^a   Liao, Y S ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Current off time; Current on time; Servo voltage; Silicon ingot; Surface roughness; WEDM

Indexed keywords

DEFECTS; INGOTS; POLISHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SURFACE ROUGHNESS; WIRE;

SURFACE SLICINGS;

ELECTRIC DISCHARGE MACHINING;

EID: 0042911877     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00718-0     Document Type: Conference Paper

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