A finite element analysis of temperature variation in silicon wafers during wiresaw slicing

International Journal of Machine Tools and Manufacture

Volumn 48, Issue 1, 2008, Pages 95-106

  Bhagavat, Sumeet ^a   Kao, Imin ^b  

^a MEMC Electronic Materials Inc   (United States)

^b STONY BROOK UNIVERSITY   (United States)

Author keywords

Nanotopography; Silicon wafer; Thermal modeling; Wafer production; Warp; Wiresaw

Indexed keywords

BOUNDARY CONDITIONS; FINITE ELEMENT METHOD; HEAT FLUX; THERMAL EFFECTS; TOPOGRAPHY;

NANOTOPOGRAPHY; THERMAL MODELINGS; WAFER PRODUCTIONS; WIRESAW SLICINGS;

SILICON WAFERS;

EID: 35348903928     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2007.07.009     Document Type: Article

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