Thick-film pressure / Force sensors on different LTCC substrates; a characterization and evaluation

5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009

Volumn , Issue , 2009, Pages 149-156

  Hrovat, Marko ^a   Belavič, Darko ^b   Uršič, Hana ^a   Kita, Jaroslaw ^c   Holc, Janez ^a   Drnovšek, Silvo ^a   Cilenšek, Jena ^a   Zarnik, Marina Santo ^b   Kosec, Marija ^a  

^a JO EF STEFAN INSTITUTE   (Slovenia)

^b HIPOT RandD   (Slovenia)

^c UNIVERSITY OF BAYREUTH   (Germany)

Author keywords

LTCC; Piezoelectric materials; Resistors; Sensors; Thick film

Indexed keywords

CERAMIC PRESSURE SENSORS; ELECTRICAL CHARACTERISTIC; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC; MECHANICAL DEFORMATION; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MORPHOTROPIC PHASE BOUNDARIES; THICK-FILM TECHNOLOGY;

ALUMINA; CERAMIC MATERIALS; CHARACTERIZATION; GLASS; LEAD; MEMS; MICROSYSTEMS; RESISTORS; SENSORS; SINTERING; SUBSTRATES; TAPES; TECHNOLOGY;

PIEZOELECTRIC MATERIALS;

EID: 84879849147     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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24. rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, Colorado, USA, pp. 278-285, April 23-26, 2007.