Integrated LTCC micro-fluidic modules - An SMT flow sensor

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 577-581

  Fournier, Y ^a   Willigens, R ^a   Maeder, T ^a   Ryser, P ^a  

^a EPFL   (Switzerland)

Author keywords

Flow sensor; Heating resistors; LTCC; Microfluidics; Surface mount technology SMT

Indexed keywords

CHEMICAL STABILITY; MICROELECTRONICS; MICROFLUIDICS; TEMPERATURE; THICK FILMS;

FLOW-SENSORS; FUNCTIONAL LAYER; LTCC; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); SENSING CIRCUITS; STRUCTURATION; THICK FILM THERMISTOR; TYPICAL APPLICATION;

SURFACE MOUNT TECHNOLOGY;

EID: 70449902240     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Wang G Folk M Elshabini A Barlow F, "Embedded passives in LTCC for RF & microwave applications", Proceedings, European Microelectronics and Packaging Symposium, Prague, 355-365, 2004.
2. D.W. Zimmerman, M.R. Fairchild, K.W. Brunner and C.W. Berlin, "Utilizing an LTCC substrate in an under-hood engine control application", Proceedings, 2004 IMAPS Conference, Ceramic Interconnect Technology, Denver, USA, TA22, 2004.
3. J.J. Santiago-Avilès, M. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, "Sensors, actuators and other non-packaging applications of LTCC tapes", Proceedings, 2004 IMAPS Conference, Ceramic Interconnect Technology, Denver, USA, INV12, 2004.
4. G.Q. Wang, K. Saxena, F. Barlow, S. Ang and A. Elshabini, "A microjet array air impingement cooling package fabricated using low temperature co-fired ceramic", Proceedings, 2004 IMAPS Conference, Ceramic Interconnect Technology, Denver, USA, TP32, 2004.
5. T. Maeder, H. Birol, C. Jacq and P. Ryser, "Integrated microfluidic devices based on low-temperature co-fired ceramic (LTCC) technology", Proceedings, 4th Korea-Switzerland Joint Symposium, Materials and MEMS for Life Science Applications, Les Diablerets, 2004.
6. H. Birol, T. Maeder, C. Jacq and P. Ryser, "3-D structuration of LTCC for sensor micro-fluidic applications", Proceedings, European Microelectronics and Packaging Symposium, Prague, 366-371, 2004.
7. H. Birol, T. Maeder, C. Jacq and P. Ryser, "Effects of firing conditions on thick-film PTC thermistor characteristics in LTCC technology", Proceedings, 2004 IMAPS Conference, Ceramic Interconnect Technology, Denver, USA, P1, 2004.
8. N.T. Nguyen, "Micromachined flow sensors - a review", Flow Measurement and Instrumentation 8 (1), 7-16, 1997.
9. M. Gongora-Rubio, L. Solá-Laguna, P.J. Moffett, J.J. Santiago-Avilés, "The utilization of low temperature co-fired ceramics (LTCC-ML) technology for meso-scale EMS, a simple thermistor based flow sensor", Sensors and Actuators 73, 215-221, 1999.