Formation of three-dimensional and nanowall structures on silicon using a hydrogen-assisted high aspect ratio etching

Journal of Vacuum Science and Technology B

Volumn 28, Issue 6, 2010, Pages 1125-1131

  Azimi, S ^a   Mehran, M ^a   Amini, A ^a   Vali, A ^a   Mohajerzadeh, S ^a   Fathipour, M ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; REACTIVE ION ETCHING; SILICON; SUBSTRATES;

DEEP REACTIVE ION ETCHING; DEEP REACTIVE-ION ETCHINGS; ETCHING PROCESS; HIGH-ASPECT-RATIO-ETCHING; MASKING LAYERS; NANOWALLS; PASSIVATION PROCESS; SILICON SUBSTRATES; THREE-DIMENSIONAL STRUCTURE; UNDERETCHING;

HYDROGEN;

EID: 78650102922     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.3497033     Document Type: Article

References (23)

1. C. M. Waits, A. Modafe, and R. Ghodssi, J. Micromech. Microeng. JMMIEZ 0960-1317 13, 170 (2003). 10.1088/0960-1317/13/2/302
2. M. P. Rao, M. F. Aimi, and N. C. MacDonald, Appl. Phys. Lett. APPLAB 0003-6951 85, 6281 (2004). 10.1063/1.1834720 (Pubitemid 40817902)
3. F. Marty, L. Rousseau, B. Saadany, B. Mercier, O. Fraņais, Y. Mitab, and T. Bourouina, Microelectron. J. MICEB9 0026-2692 36, 673 (2005). 10.1016/j.mejo.2005.04.039 (Pubitemid 40973309)
4. K. Gantz, L. Renaghan, and M. Agah, J. Micromech. Microeng. JMMIEZ 0960-1317 18, 025003 (2008). 10.1088/0960-1317/18/2/025003 (Pubitemid 351591248)
5. A. Bertsch, S. Jiguet, P. Bernhard, and P. Renaud, Mater. Res. Soc. Symp. Proc. MRSPDH 0272-9172 758, 3 (2003).
6. Y. Kanamori, J. Sato, T. Shimano, S. Nakamura, and K. Hane, Microsyst. Technol. MCTCEF 0946-7076 13, 1411 (2007). 10.1007/s00542-007-0380-7 (Pubitemid 47324643)
7. E. J. Teo, M. B. H. Breese, E. P. Tavernier, A. A. Bettiol, F. Watt, M. H. Liu, and D. J. Blackwood, Appl. Phys. Lett. APPLAB 0003-6951 84, 3202 (2004). 10.1063/1.1723703
8. K. Robbie and A. Lakhtakia, Nature (London) NATUAS 0028-0836 384, 616 (1996). 10.1038/384616a0 (Pubitemid 27021509)
9. M. W. Horn, M. D. Pickett, R. Messier, and A. Lakhtakia, Nanotechnology NNOTER 0957-4484 15, 303 (2004). 10.1088/0957-4484/15/3/013
10. G. T. A. Kovacs, N. I. Maluf, and K. E. Petersen, Proc. IEEE IEEPAD 0018-9219 86, 1536 (1998). 10.1109/5.704259
11. S. Darbari, S. Azimi, S. Mohajerzadeh, A. Sammak, N. Izadi, and S. Famini, J. Microelectromech. Syst. JMIYET 1057-7157 17, 1489 (2008). 10.1109/JMEMS.2008.2007247
12. H. Qu, D. Fang, and H. Xie, IEEE Sens. J. ISJEAZ 1530-437X 8, 1511 (2008). 10.1109/JSEN.2008.923582
13. S. Lee, S. Park, J. Kim, S. Lee, and D. Cho, J. Microelectromech. Syst. JMIYET 1057-7157 9, 557 (2000). 10.1109/84.896767 (Pubitemid 32169008)
14. W. G. Wu, Q. H. Chen, G. Z. Yan, D. Q. Yin, Z. Y. Chen, Y. L. Hao, A. S. Xu, and Y. Y. Wang, Sens. Actuators, A SAAPEB 0924-4247 135, 758 (2007). 10.1016/j.sna.2006.08.007 (Pubitemid 46518076)
15. L. S. Pakula, H. Yang, H. T. Pham, P. J. French, and P. M. Sarro, J. Micromech. Microeng. JMMIEZ 0960-1317 14, 1478 (2004). 10.1088/0960-1317/14/11/ 007
16. S. Lucyszyn, IEEE Proceedings on Science, Measurement, and Technology, 2004 (unpublished), Vol. 151.
17. A. Geisberger, D. Kadylak, and M. Ellis, J. Micromech. Microeng. JMMIEZ 0960-1317 16, 1943 (2006). 10.1088/0960-1317/16/10/005 (Pubitemid 44403640)
18. F. Laemer and A. Schilp, U.S. Patent Nos. 5, 501, 893 (1996).
19. I. W. Rangelow, J. Vac. Sci. Technol. A JVTAD6 0734-2101 21, 1550 (2003).
20. M. J. de Boer, J. G. E. Gardeniers, H. V. Jansen, E. Smulders, M. -J. Gilde, G. Roelofs, J. N. Sasserath, and M. Elwenspoek, J. Microelectromech. Syst. JMIYET 1057-7157 11, 385 (2002). 10.1109/JMEMS.2002.800928 (Pubitemid 34950046)
21. A. Sammak, S. Azimi, N. Izadi, B. K. Hosseinieh, and S. Mohajerzadeh, J. Microelectromech. Syst. JMIYET 1057-7157 16, 912 (2007). 10.1109/JMEMS.2007. 901123 (Pubitemid 47278834)
22. E. Leclerc, K. S. Furukawa, F. Miyata, Y. Sakai, T. Ushida, and T. Fujii, Biomaterials BIMADU 0142-9612 25, 4683 (2004). 10.1016/j.biomaterials.2003.10. 060 (Pubitemid 38561155)
23. D. Gallego, N. Ferrell, Y. Sun, and D. J. Hansford, Mater. Sci. Eng., C MSCEEE 0928-4931 28, 353 (2008). 10.1016/j.msec.2007.04.021 (Pubitemid 351296139)