Micromachining on copper and nickel by electrochemical wet stamping

Journal of Micromechanics and Microengineering

Volumn 20, Issue 11, 2010, Pages

  Tang, Jing ^a   Zhang, Li ^b,c   Tian, Xiaochun ^a  

^a FUZHOU UNIVERSITY   (China)

^b XIAMEN UNIVERSITY   (China)

^c UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AGAROSE; AGAROSE STAMP; ANODIC DISSOLUTION PROCESS; CONTACT AREAS; COPPER ELECTRODES; CUPROUS OXIDE; ELECTROCHEMICAL BEHAVIORS; ELECTROCHEMICAL MACHINING; ELECTROCHEMICAL MECHANISMS; ELECTROCHEMICAL MICRO-MACHINING; ELECTROCHEMICAL REACTIONS; ETCHING PROCESS; ETCHING SOLUTIONS; GEL STRENGTHS; PULSE AMPLITUDE; PULSE DURATIONS; TRANSPASSIVATION; VOLTAGE PULSE; WET STAMPING;

COMPOSITE MICROMECHANICS; COPPER; DISSOLUTION; ELECTRIC POTENTIAL; ELECTROCHEMICAL CUTTING; ETCHING; MICROMACHINING; NICKEL; PASSIVATION; STAMPING;

ELECTROCHEMICAL ELECTRODES;

EID: 78649739177     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/11/115030     Document Type: Article

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