Fabrication of three-dimensional Cu/Ni multilayered microstructure by wet process

Electrochimica Acta

Volumn 49, Issue 6, 2004, Pages 945-950

  Arai, Susumu ^a   Hasegawa, Takahide ^a   Kaneko, Norio ^a  

^a SHINSHU UNIVERSITY   (Japan)

Author keywords

Copper; Nickel; Selective etching; Thiourea; Three dimensional microstructure

Indexed keywords

COPPER; ELECTROPLATING; ETCHING; FABRICATION; MORPHOLOGY; MULTILAYERS; NICKEL; PHOTOLITHOGRAPHY; WETTING;

THREE-DIMENSIONAL MICROSTRUCTURES;

MICROSTRUCTURE;

EID: 0346639335     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2003.10.006     Document Type: Article

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