Encapsulation of capacitive micromachined ultrasonic transducers using viscoelastic polymer

Journal of Microelectromechanical Systems

Volumn 19, Issue 6, 2010, Pages 1341-1351

  Lin, Der Song ^a   Zhuang, Xuefeng ^b   Wong, Serena H ^a   Kupnik, Mario ^a   Khuri Yakub, Butrus Thomas ^a  

^a STANFORD UNIVERSITY   (United States)

^b Kolo Technologies Inc   (United States)

Author keywords

Acoustic transducers; capacitive micromachined ultrasonic transducers (CMUTs); finite element model (FEM); packaging; polydimethylsiloxane (PDMS); viscoelasticity

Indexed keywords

ACTUATION VOLTAGES; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; DESIGN PROCESS; DYNAMIC BEHAVIORS; DYNAMIC PERFORMANCE; FINITE-ELEMENT MODELS; GLASS TRANSITION TEMPERATURE; HIGHER FREQUENCIES; LOW YOUNG'S MODULUS; OPERATION POINT; POLYDIMETHYLSILOXANE (PDMS); ROOM TEMPERATURE; STATIC AND DYNAMIC; STATIC BEHAVIORS; THERAPEUTIC ULTRASOUND; VISCO-ELASTIC MATERIAL; VISCOELASTIC POLYMERS;

ACOUSTIC TRANSDUCERS; ELASTICITY; FINITE ELEMENT METHOD; GLASS TRANSITION; INSULATION; MEDICAL IMAGING; MICROCHANNELS; PLASTIC COATINGS; PLATES (STRUCTURAL COMPONENTS); POLYMERS; SILICONES; TRANSDUCERS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC WAVES; ULTRASONICS; VISCOELASTICITY; VISCOSITY;

ULTRASONIC TRANSDUCERS;

EID: 78649637698     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2076786     Document Type: Article

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