SCOPUS 정보 검색 플랫폼

Surface and Interface Analysis

Volumn 42, Issue 12-13, 2010, Pages 1681-1684

Wetting of Cu substrates with micrometer and nanometer grains by molten Sn-3.5Ag-0.7Cu alloy

(6) Shen, Ping a Yin, Zhongfa a Yang, Jun a Sun, Jianxin a Jiang, Zhonghao a Jiang, Qichuan a

a Jilin University (China)

Author keywords

interfaces; intermetallic compounds; nanomaterials; wetting

Indexed keywords

CU ALLOY; CU SUBSTRATE; DIFFUSIVITIES; INTERFACES; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUNDS; KIRKENDALL VOID; NANOCRYSTALLINE SURFACES; NANOMATERIALS; NANOMETER GRAINS; SN-3.5AG; SURFACE FREE ENERGY; WETTING BEHAVIOR;

ADSORPTION; CERIUM ALLOYS; INTERMETALLICS; MICROMETERS; NANOCRYSTALLINE ALLOYS; NANOSTRUCTURED MATERIALS; SILVER ALLOYS; SUBSTRATES; TIN; WETTING;

SOLDERING ALLOYS;

EID: 78649551841 PISSN: 01422421 EISSN: 10969918 Source Type: Journal
DOI: 10.1002/sia.3345 Document Type: Article

Times cited : (5)

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