Deformation mechanism transition caused by strain rate in a pulse electric brush-plated nanocrystalline Cu

Journal of Applied Physics

Volumn 104, Issue 5, 2008, Pages

  Jiang, Zhonghao ^a   Zhang, Hanzhuo ^a   Gu, Changdong ^a   Jiang, Qing ^a   Lian, Jianshe ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; BRUSHES; COMPRESSION TESTING; COPPER; COPPER ALLOYS; CRYSTAL GROWTH; DEFORMATION; ELECTRIC MACHINERY; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; MECHANISMS; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS; PHOTORESISTS; PLASTIC DEFORMATION; PLASTICS;

ACTIVATION VOLUMES; BRUSH-PLATING; COMPRESSION TESTS; DEFORMATION MECHANISMS; DISLOCATION ACTIVITY; DISLOCATION EMISSIONS; NANOCRYSTALLINE CU; PLASTIC STRAINING; ROOM TEMPERATURES; STRAIN RATE SENSITIVITY;

STRAIN RATE;

EID: 51849108985     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2973200     Document Type: Article

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