Investigation of the dynamic reactive wetting of Sn-Ag-Cu solder alloys on Ni(P)/Au coated Cu substrates

Materials Transactions

Volumn 50, Issue 11, 2009, Pages 2695-2698

  Kim, Taeyoung ^a   Lee, Joonho ^a   Kim, Yunkyum ^a   Kim, Jong Min ^b   Yuan, Zhangfu ^c  

^a Korea University   (South Korea)

^b Chung Ang University   (South Korea)

^c PEKING UNIVERSITY   (China)

Author keywords

Dynamic reactive wetting; Lead free solder; Nickel( phosphate) gold coating; Tin silver copper alloy

Indexed keywords

LEAD FREE SOLDERS; REACTIVE WETTING; TIN-SILVER-COPPER ALLOY; TIN-SILVER-COPPER ALLOYS;

CHIP SCALE PACKAGES; DIFFUSION COATINGS; DROP FORMATION; GOLD COATINGS; INTERMETALLICS; LEAD; NICKEL ALLOYS; NICKEL COATINGS; PROTECTIVE COATINGS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; SURFACES; TIN; TIN ALLOYS; TITANIUM COMPOUNDS; WETTING;

COPPER ALLOYS;

EID: 73349086203     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.M2009242     Document Type: Article

References (7)

1. M. Abtew and G. Selvaduray: Mater. Sci. Eng. 27 (2000) 95-141.
2. N. Eustathopoulos, M. G. Nicholas and B. Drevet: Wettability at High Temperatures, (Pergamon, Amsterdam, 1999) p. 43.
3. M. Li, F. Zhang, W. T. Chen, K. Zeng, K. N. Tu, H. Balkan and P. Elenius: J. Mater. Res. 17 (2002) 1612-1621.
4. J. Liang, N. Dariavach, P. Callahan and D. Shangguan: Mater. Trans. 47 (2006) 317-325.
5. W. K. Choi and H. M. Lee: J. Electron. Mater. 28 (1999) 1251-1255.
6. C. H. P. Lupis: Chemical Thermodynamics of Materials, (North-Holland, New York, 1983) p. 134.
7. I. Aksay, C. Hoye and J. Pask: J. Phys. Chem. 78 (1974) 1178.