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Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 418-421

Abnormal growth of intermetallic compounds in asymmetrical Cu/Sn/Ag couples

(2) Zou, H F a Zhang, Z F a

a INSTITUTE OF METAL RESEARCH (China)

Author keywords

[No Author keywords available]

Indexed keywords

ABNORMAL GROWTH; DIFFERENT THICKNESS; INITIAL STATE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LIQUID STATE; LONG-TIME AGING; PLATE-TYPE;

ELECTRONICS PACKAGING; GROWTH KINETICS; INTERMETALLICS; PACKAGING; REACTION KINETICS; SILVER; SOLDERING ALLOYS;

TIN;

EID: 78449276059 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2010.5582863 Document Type: Conference Paper

Times cited : (1)

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