Effect of negative substrate bias on the structure and properties of Ta coatings deposited using modulated pulse power magnetron sputtering

IEEE Transactions on Plasma Science

Volumn 38, Issue 11 PART 1, 2010, Pages 3071-3078

  Lin, Jianliang ^a   Moore, John J ^a   Sproul, William D ^a,b   Lee, Sabrina L ^c   Wang, Jun ^a,d  

^a Department of Geology and Geological Engineering   (United States)

^b Reactive Sputtering INC   (United States)

^c Benet Laboratories   (United States)

^d HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

High power pulsed magnetron sputtering (HPPMS HiPIMS); modulated pulse power (MPP); negative substrate bias; tantalum (Ta) coating; thick coating

Indexed keywords

ADHESION STRENGTHS; ALPHA PHASE; BETA-PHASE; COATING COVERAGE; CRYSTALLINE PHASE; GROWING FILMS; HIGH DEPOSITION RATES; HIGH POWER PULSED MAGNETRON SPUTTERING; ION CURRENT DENSITY; METALLIC IONS; NEGATIVE BIAS; NEGATIVE SUBSTRATES; PHASE FORMATIONS; PULSE POWER; ROCKWELL; SCRATCH TEST; STRUCTURE AND PROPERTIES; THICK COATINGS; X-RAY STRESS ANALYZER;

COATINGS; ION BOMBARDMENT; IONS; MAGNETRON SPUTTERING; SUBSTRATES; TANTALUM;

BIAS VOLTAGE;

EID: 78349305820     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2010.2068316     Document Type: Conference Paper

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