Modulated pulse power sputtered chromium coatings

Thin Solid Films

Volumn 518, Issue 5, 2009, Pages 1566-1570

  Lin, Jianliang ^a   Moore, John J ^a   Sproul, William D ^a,b   Mishra, Brajendra ^a   Wu, Zhili ^a  

^a Department of Geology and Geological Engineering   (United States)

^b Reactive Sputtering INC   (United States)

Author keywords

Adhesion; Cr coating; High power pulsed magnetron sputtering (HPPMS); Ion bombardment; Modulated pulse power (MPP)

Indexed keywords

CHROMIUM COATINGS; CLOSED FIELD UNBALANCED MAGNETRON SPUTTERING SYSTEMS; COATING DEPOSITION; CR COATING; DC MAGNETRON SPUTTERING; DC PLASMA; FINER GRAINS; HIGH POWER PULSED MAGNETRON SPUTTERING (HPPMS); HIGHLY-IONIZED; ION FLUXES; MODULATED PULSE POWER (MPP); PEAK CURRENT DENSITY; PULSE POWER; TARGET MATERIALS; TARGET POWER DENSITY;

ADHESION; CHROMIUM; ION BOMBARDMENT; IONIZATION OF GASES; IONS; MAGNETRON SPUTTERING; MAGNETRONS; PLASMA DIAGNOSTICS; PLASMAS; TARGETS;

CHROMATE COATINGS;

EID: 70449564736     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.09.118     Document Type: Article

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