Advanced setup for thermal cycling of power modules following definable junction temperature profiles

2010 International Power Electronics Conference - ECCE Asia -, IPEC 2010

Volumn , Issue , 2010, Pages 962-969

  Stupar, A ^a   Bortis, D ^a   Drofenik, U ^a   Kolar, J W ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Power cycling tests; Reliability; Test system

Indexed keywords

ARBITRARY TEMPERATURE; DESIGN PROCEDURE; DEVICE UNDER TEST; EXPERIMENTAL DATA; JUNCTION TEMPERATURES; PHYSICAL MODEL; POWER CYCLING; POWER ELECTRONIC DEVICES; POWER MODULE; TEST SYSTEMS;

POWER ELECTRONICS; QUALITY ASSURANCE; TEMPERATURE CONTROL; TESTING;

RELIABILITY ANALYSIS;

EID: 77956530093     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPEC.2010.5542179     Document Type: Conference Paper

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