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Volumn , Issue , 2011, Pages

Railway traction reliability

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY TECHNOLOGY; DUTY CYCLES; EXTRAPOLATION METHODS; FAILURE MECHANISM; JUNCTION TEMPERATURES; LIFE-TIMES; NUMBER OF CYCLES TO FAILURE; POWER CYCLING; RAILWAY TRACTION; TEMPERATURE CYCLES; THERMAL CONSTRAINTS; THERMAL CYCLE;

EID: 79953732618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (17)
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  • 2
    • 0004844660 scopus 로고
    • Thermal cycling : First comparative tests on presspacked and direct bonding for GTOs and IGBTs
    • Arcachon (France)
    • Coquery G. Thermal cycling : first comparative tests on presspacked and direct bonding for GTOs and IGBTs. Proc. of ESREF, Arcachon (France), 1993.
    • (1993) Proc. of ESREF
    • Coquery, G.1
  • 3
    • 79953754007 scopus 로고
    • Reliability of the 400A IGBT modules for traction converters
    • Sevilla (Spain)
    • Coquery G., Lallemand R., Wagner D., and Gibard P. Reliability of the 400A IGBT modules for traction converters. Proc. of EPE, Sevilla (Spain), Vol 5, pp. 219-234, 1995.
    • (1995) Proc. of EPE , vol.5 , pp. 219-234
    • Coquery, G.1    Lallemand, R.2    Wagner, D.3    Gibard, P.4
  • 4
    • 0030274037 scopus 로고    scopus 로고
    • Reliability indicators for Lift-off of bond wires in IGBT power modules
    • Farokhzad B., Türkes P., Wolfgang E., and Goser K. Reliability Indicators for Lift-Off of Bond Wires in IGBT Power Modules. Microelectron. Reliab., Vol 36, pp. 1863- 1866, 1996.
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    • Farokhzad, B.1    Türkes, P.2    Wolfgang, E.3    Goser, K.4
  • 5
    • 0031378688 scopus 로고    scopus 로고
    • Power cycling stability of IGBT modules
    • Society, NO, Oct 5-9
    • Auerbach F and Lenniger A. Power Cycling Stability of IGBT Modules. IEEE Ind. Appl. Society, NO, Oct 5-9, 1997.
    • (1997) IEEE Ind. Appl.
    • Auerbach, F.1    Lenniger, A.2
  • 6
    • 0032083619 scopus 로고    scopus 로고
    • On the effect of power cycling stress on IGBT modules
    • PII S002627149800081X
    • Cova P and Fantini F. on the effect of Power Cycling Stress on IGBT Modules. Microelectron. Reliab., Vol 38, pp. 1347-1352, 1998. (Pubitemid 128634030)
    • (1998) Microelectronics Reliability , vol.38 , Issue.6-8 , pp. 1347-1352
    • Cova, P.1    Fantini, F.2
  • 7
    • 72449176672 scopus 로고    scopus 로고
    • Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction highpower IGBT modules
    • Lausanne (Switzerland), 7-9 Sept
    • Coquery G, Lallemand R, Berg H, Sommer K, Wagner D. and Piton M. Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction highpower IGBT modules, Proc. of EPE, Lausanne (Switzerland), 7-9 Sept. 1999.
    • (1999) Proc. of EPE
    • Coquery, G.1    Lallemand, R.2    Berg, H.3    Sommer, K.4    Wagner, D.5    Piton, M.6
  • 8
    • 0032083762 scopus 로고    scopus 로고
    • Advanced IGBT modules for railway traction applications: Reliability testing
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    • Berg H and Wolfgang E. Advanced IGBT Modules for Railway Traction Applications : Reliability Testing. Microelectron. Reliab., Vol. 38, pp. 1319-1323, 1998. (Pubitemid 128634026)
    • (1998) Microelectronics Reliability , vol.38 , Issue.6-8 , pp. 1319-1323
    • Berg, H.1    Wolfgang, E.2
  • 10
    • 2342650702 scopus 로고    scopus 로고
    • Temperature measurements of semiconductor devices- A review
    • San José (California, USA)
    • D. L. Blackburn, "Temperature measurements of semiconductor devices- a review", Proc. of 20th IEEE SEMI-THERM Symposium, San José (California, USA), 2004.
    • (2004) Proc. of 20th IEEE SEMI-THERM Symposium
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  • 11
    • 33747782080 scopus 로고    scopus 로고
    • Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current
    • DOI 10.1016/j.microrel.2006.07.078, PII S0026271406002460, Proceedings of the 17th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
    • X. Perpiñà, J. F. Serviere, J. Saiz, D. Barlini, M. Mermet-Guyennet, J. Millán, "Temperature Measurement on Series Resistance and Devices in Power Packs based on On-state Voltage Drop Monitoring at High Current" Microelectron. Reliab., Vol 46, pp.1834-1839, 2006. (Pubitemid 44278117)
    • (2006) Microelectronics Reliability , vol.46 , Issue.9-11 , pp. 1834-1839
    • Perpina, X.1    Serviere, J.F.2    Saiz, J.3    Barlini, D.4    Mermet-Guyennet, M.5    Millan, J.6
  • 12
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    • Current and temperature distribution in multi-chip modules under inverter operation
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    • (1999) Proc. of EPE
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  • 13
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.