Computationally efficient integration of complex thermal multi-chip power module models into circuit simulators

Fourth Power Conversion Conference-NAGOYA, PCC-NAGOYA 2007 - Conference Proceedings

Volumn , Issue , 2007, Pages 550-557

  Drofenik, Uwe ^a   Cottet, Didier ^b   Müsing, Andreas ^a   Meyer, Jean Marc ^b   Kolar, Johann W ^a  

^a ETH ZURICH   (Switzerland)

^b ABB SWITZERLAND LTD   (Switzerland)

Author keywords

Electric thermal simulation; Increasing simulation speed; Thermal coupling

Indexed keywords

COMPUTATIONAL EFFICIENCY; COUPLED CIRCUITS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; POWER ELECTRONICS; THERMOELECTRIC POWER;

ELECTRIC THERMAL SIMULATION; INCREASING SIMULATION SPEED; SIMULATION TIME; THERMAL COUPLING;

CIRCUIT SIMULATION;

EID: 34748889482     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PCCON.2007.373020     Document Type: Conference Paper

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