Lifetime prediction and design of reliability tests for high-power devices in automotive applications

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 4, 2003, Pages 191-196

  Ciappa, Mauro ^a   Carbognani, Flavio ^a   Fichtner, Wolfgang ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Automotive electronics; Hybrid vehicles; Lifetime prediction; Power devices

Indexed keywords

ACCELERATION; AUTOMOTIVE ENGINEERING; DATA REDUCTION; FATIGUE OF MATERIALS; STATISTICAL METHODS; THERMAL CYCLING; VEHICLES;

AUTOMOTIVE ELECTRONICS; HYBRID VEHICLES; LIFETIME PREDICTIONS; POWER DEVICES;

RELIABILITY;

EID: 3042769286     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.818148     Document Type: Article

References (6)

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5. C. Yun, P. Malberti, M. Ciappa, and W. Fichtner, "Thermal component model for electrothermal analysis of IGBT module systems," IEEE Trans. Adv. Packag., vol. 24, pp. 401-406, Aug. 2001.
6. M. Ciappa, Some Reliability Aspects of IGBT Modules for High-Power Applications. Konstanz, Germany: Hartung-Gorre, 2001.