Microfabrication of a nickel mold insert by a modified deep X-ray lithography process and its application to hot embossing

Microelectronic Engineering

Volumn 87, Issue 12, 2010, Pages 2449-2455

  Lee, Bong Kee ^a   Kim, Jong Hyun ^a   Kim, Dong Sung ^b   Chang, Suk Sang ^a   Kwon, Tai Hun ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Chung Ang University   (South Korea)

Author keywords

Deep X ray lithography; Hot embossing; Microchannel; Nickel mold insert

Indexed keywords

ADHESIVE LAYERS; DEEP X-RAY LITHOGRAPHY; ELECTROPLATING PROCESS; FABRICATION METHOD; HOT EMBOSSING PROCESS; HOT-EMBOSSING; METALLIC MOLD; METALLIC SUBSTRATE; MOLD INSERTS; SECONDARY RADIATIONS; SHORT DURATIONS; X-RAY EXPOSURE;

DIE CASTING INSERTS; FABRICATION; MICROCHANNELS; MOLDS; NICKEL; PHOTORESISTS; X RAY LITHOGRAPHY; X RAYS;

LITHOGRAPHY;

EID: 77956268230     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.04.023     Document Type: Article

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