Electromigration effects upon the low-temperature Sn/Ni interfacial reactions

Journal of Materials Research

Volumn 18, Issue 6, 2003, Pages 1293-1296

  Chen, Chih Ming ^a   Chen, Sinn Wen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; GRAIN BOUNDARIES; NICKEL COMPOUNDS; NUCLEATION;

METASTABLE PHASES;

SURFACE CHEMISTRY;

EID: 0038001007     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0177     Document Type: Article

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