Diamond bit cutting for processing high topography wafers

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 267-271

  Agarwal, R ^a   Pham, N ^a   Cotrin, R ^a   Andrei, A ^a   Ruythooren, W ^a   Iker, F ^a   Soussan, P ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

PROCESSING STEPS; SMOOTH SURFACE;

DIAMONDS; ELECTRONICS PACKAGING; POLYIMIDES; SURFACE TOPOGRAPHY; TIN;

CUTTING;

EID: 77950919925     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416538     Document Type: Conference Paper

References (4)

1. K. Arai et al., "A new planarization technique by high precision diamond cutting for packaging," ISSM 2004.
2. W. Ruythooren et al., "Cu-Cu bonding alternative to solder based micro-bumping," EPTC 2007.
3. F. Iker et al., "Diamond bit cutting as alternative to polymer patterning for 3D interconnections," ECTC 2009.
4. F. Iker et al , "3D embedding and interconnection of ultra thin (< 20 μm) silicon dies.", EPTC 2007 p222-226.