A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

Electrophoresis

Volumn 31, Issue 15, 2010, Pages 2526-2533

  Segato, Thiago Pinotti ^a,b   Coltro, Wendell Karlos Tomazelli ^b,c   Almeida, André Luiz De Jesus ^d   Piazetta, Maria Helena De Oliveira ^d   Gobbi, Angelo Luiz ^d   Mazo, Luiz Henrique ^a   Carrilho, Emanuel ^a,b  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b Instituto Nacional de Ciência e Tecnologia em Bioanalítica   (Brazil)

^c FEDERAL UNIVERSITY OF GOIÁS   (Brazil)

^d LABORATÓRIO NACIONAL DE LUZ SÍNCROTRON   (Brazil)

Author keywords

Contactless conductivity detection; Microchip electrophoresis; PDMS; Wet chemical etching

Indexed keywords

CHEMICAL BONDS; CHEMICAL DETECTION; ELECTROPHORESIS; FABRICATION; GLASS; GLASS SUBSTRATES; MICROPROCESSOR CHIPS; WET ETCHING;

BONDING PROCESS; CAPACITIVELY COUPLED CONTACTLESS CONDUCTIVITY DETECTION; CHIP TO CHIPS; CONTACTLESS CONDUCTIVITY DETECTION; GLASS CHANNELS; GLASS PLATE; GLASS SUBSTRATES; MICROCHIP ELECTROPHORESIS; PDMS; WET-CHEMICAL ETCHING;

MICROCHANNELS;

DIMETICONE; GLASS;

ARTICLE; BIOCHIP; CHEMICAL BINDING; CONTROLLED STUDY; DEVICE; ELECTRIC CONDUCTIVITY; ELECTROCHEMICAL DETECTION; ELECTRODE; ELECTROOSMOSIS; FLUORESCENCE ANALYSIS; MICROCHIP ELECTROPHORESIS; NANOFABRICATION; RELIABILITY; REPRODUCIBILITY;

EID: 77955005683     PISSN: 01730835     EISSN: 15222683     Source Type: Journal    
DOI: 10.1002/elps.201000099     Document Type: Article

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