Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder

Journal of Alloys and Compounds

Volumn 470, Issue 1-2, 2009, Pages 145-149

  Wei, Chen ^a   Liu, Yongchang ^a   Gao, Zhiming ^a   Ma, Changsheng ^a   Wan, Jingbo ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Intermetallics; Lead free solder; Microhardness; Microstructure; Thermal aging

Indexed keywords

BRAZING; COARSENING; DENDRITES (METALLOGRAPHY); INDIUM; INTERMETALLICS; LEAD; METALLIC COMPOUNDS; MICROHARDNESS; MICROSTRUCTURE; NEURONS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL AGING; WELDING; ZINC;

INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MICROSTRUCTURAL ANALYSIS; SN DENDRITES; SN-AG-ZN;

TIN;

EID: 59249096626     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.02.055     Document Type: Article

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