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Journal of Applied Physics

Volumn 107, Issue 10, 2010, Pages

Thermal stability of copper nitride thin films: The role of nitrogen migration

(5) Gonzalez Arrabal, R a,b Gordillo, N c,d Martin Gonzalez, M S b Ruiz Bustos, R e Agullo Lopez F d,f

a UNIVERSIDAD POLITÉCNICA DE MADRID (Spain)

b INSTITUTO DE MICROELECTRÓNICA DE MADRID (Spain)

c Sygnis Biotech Parque Científico de Madrid (Spain)

d CENTRO DE MICROANÁLISIS DE MATERIALES (Spain)

e Parque Científico y Tecnológico de Albacete (Spain)

f UNIVERSIDAD AUTÓNOMA DE MADRID (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER COMPOUNDS; CRYSTAL ATOMIC STRUCTURE; CRYSTAL ORIENTATION; ION BEAMS; NITRIDES; OPTICAL PROPERTIES; RHENIUM COMPOUNDS; SPECTROSCOPIC ANALYSIS; SPECTROSCOPIC ELLIPSOMETRY; THERMODYNAMIC STABILITY; X RAY DIFFRACTION;

ATOMIC COMPOSITIONS; ATOMIC CONCENTRATION; COPPER NITRIDE THIN FILMS; CRYSTALLOGRAPHIC ORIENTATIONS; FILM SURFACES; ION BEAM ANALYSIS; NITROGEN EXCESS; NITROGEN MIGRATION;

THIN FILMS;

EID: 77952988627 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3369450 Document Type: Article

Times cited : (47)

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