Tin-induced dynamic embrittlement of Cu-7% Sn bicrystals with a Σ5 boundary

Acta Materialia

Volumn 47, Issue 9, 1999, Pages 2797-2808

  Muthiah, R C ^a   Pfaendtner, J A ^a   Ishikawa, S ^a   McMahon Jr , C J ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; COPPER; CRACK PROPAGATION; CREEP; CRYSTAL SYMMETRY; DIFFUSION; GRAIN BOUNDARIES; STRESS INTENSITY FACTORS; TIN;

DIFFUSION BONDED BICRYSTAL; PLASTIC CREEP; SURFACE SEGREGATION;

EMBRITTLEMENT;

EID: 0032673128     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00117-2     Document Type: Article

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