Evidence for the intergranular segregation of tin to grain boundaries of a Cu-Sn alloy and its consequences for dynamic embrittlement

Materials Science and Engineering: A

Volumn 458, Issue 1-2, 2007, Pages 123-125

  Liu, XinYu ^a   Tham, Douglas ^a   Yates, Douglas ^a   McMahon, Charles J ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

Cu Sn alloy; Dynamic embrittlement; Intergranular segregation

Indexed keywords

AGING OF MATERIALS; EMBRITTLEMENT; GRAIN BOUNDARIES; SEGREGATION (METALLOGRAPHY); TIN;

DYNAMIC EMBRITTLEMENT; INTERGRANULAR SEGREGATION;

COPPER ALLOYS;

AGING OF MATERIALS; COPPER ALLOYS; EMBRITTLEMENT; GRAIN BOUNDARIES; SEGREGATION (METALLOGRAPHY); TIN;

EID: 34147160637     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.103     Document Type: Article

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