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Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2676-2684

Finite element modeling of stress evolution in Sn films due to growth of the Cu 6Sn 5 intermetallic compound

(4) Buchovecky, Eric a Jadhav, Nitin a Bower, Allan F a Chason, Eric a

a Brown University (United States)

Author keywords

Finite element; Grain boundary diffusion; Pb free solder; Sn whisker

Indexed keywords

DIFFERENT MECHANISMS; EXPERIMENTAL OBSERVATION; FINITE ELEMENT; FINITE ELEMENT MODELING; FINITE ELEMENT SIMULATIONS; GRAIN-BOUNDARY DIFFUSION; INTERMETALLIC COMPOUNDS; INTERMETALLIC PHASE; MODEL RESULTS; PB FREE SOLDERS; PLASTIC BEHAVIOR; SN WHISKER; STRESS EVOLUTION; STRESS GENERATION;

COPPER; CRYSTAL WHISKERS; DIFFUSION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERMETALLICS; LEAD; PHASE INTERFACES; SIMULATORS; SOLDERING ALLOYS;

TIN;

EID: 72549097230 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0911-3 Document Type: Article

Times cited : (46)

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